Leica Geosystems to present at Bau 2017

Leica Geosystems will presents its latest innovations at Bau 2017 in Munich, Germany at Hall B6, Booth 411.

Bauis the world’s leading trade fair for architecture, materials and systems.

Key topics of the event are:

• BIM：计划的未来
• Digital construction industry and integral planning
• 生活与建筑2020

At this important exhibition we will be present with our latest innovations and integrated measurement solutions. How about a hands-on experience with ourLeica Disto™S910and its revolutionary P2P Technology? Measure anything from anywhere – no matter what shape, how complex or how hard to reach!

Leica Disto™草图和Disto™的组合使您的工作流程更加有效。在竞争环境中，衡量和记录可以直接在您首选软件中使用的结果比以往任何时候都更为重要。在BAU 2017上了解有关该解决方案的简单性和惊人功能的更多信息。

与莉卡在一起DS2000you can now bring all your underground tasks and data into one easy and convenient cloud interface. TheLeica DX经理为您提供控制，以更新图纸，原始数据，位置图片，数据层和移动表格，并在企业级别实时远程远程远程远程远程远程远程远程远程远程远程远程远程远程远程远程远程远程的远程。

There will be even more to come ---