Leica Geosystems将在BAU 2017上映

徽标包

Leica Geosystemswill presents its latest innovations at Bau 2017 in Munich, Germany at Hall B6, Booth 411.

是世界领先的建筑,材料和系统贸易展览会。

活动的关键主题是:

  • BIM: The future of planning
  • 数字建筑业和整体规划
  • Living and Building 2020

At this important exhibition we will be present with our latest innovations and integrated measurement solutions. How about a hands-on experience with ourLeica Disto™S910及其革命性的P2P技术?从任何地方测量任何东西 - 无论形状,多么复杂或多么难以达到!

这combination of the Leica DISTO™ sketch and a DISTO™ makes your workflow even more efficient. To measure and document the results that can be used directly in your preferred software is today more important than ever before in a competitive environment. Find out more about the simplicity and amazing functionality of this solution at Bau 2017.

与莉卡在一起DS2000现在,您可以将所有地下任务和数据带入一个简单便捷的云接口。这Leica DX经理gives you the control to update drawings, raw data, location pictures, data layers and mobile forms remotely in real time at an enterprise level.

将会还有更多---

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